Wedge bonder JFP WB200
Semi-automatic ball, wedge & bump wire bonder / JFP MICROTECHNIC
Contacts : THOMASSET Muriel
Location : E72
Semi-Automatic Wire Bonder
Ball , Wedge & Bump
Caractéristiques
- Mode : SEMI-AUTO, Full MANUAL, AUTO-BOND
- Platine : Motorized X & Y : 50x50mm, X&Y accuracy 2μm
- Materials : Gold or Aluminium - diam 25µm for gold
- Others : Automatic motorized wire Spool: 2’’
- Others : Vertical Camera, No parallax
- Others : Motorized up-down Clamp
