Dry Etching

 

A short description of the ressource

 

ICP-RIE SENTECH SI500

Chlorine, Bromine plasma.

ICP-RIE SENTECH SI500S

Chlorine, Bromine plasma ; R&D.

STS Multiplex ICP

Chlorine, Fluorine plasma

ICP-DRIE SPTS

Fluorine plasma. Deep Reactive Ion Etching

ICP Sentech SI500

Fluorine plasma

CCP-RIE NEXTRAL (1)

Fluorine plasma

CCP-RIE NEXTRAL (2)

Fluorine plasma.

CCP-RIE ADVANCE VACCUM

Fluorine plasma

IBE Roth & Rau Ionsys 500 (1)

Ion Beam Etcher

IBE Roth & Rau Ionsys 500 (2)

Ion Beam Etcher

Xactix – XeF2

XeF2 ( xenon di-fluoride) reactor

NANOPLAS

High Density Radical Flux reactor

DIENER Nano

Low-pressure plasma at 13.56 MHz

DIENER Pico

Low-pressure plasma at 40KHz

CCP-RIE NEXTRAL 56

CCP-RIE Chlorine or CH4-O2 etching