Dry Etching

 

A short description of the ressource

 

ICP-RIE SENTECH SI500

Cl-, Br- based plasma ICP-RIE equipment

ICP-RIE SENTECH SI500S

Research and development Cl- and Br- based plasma ICP-RIE equipment. Campains operations. Plasma tools available.

ICP Sentech SI500 Fluor

this icp-rie fluor etch silicon, silica, silicon nitride

ICP-DRIE SPTS

Plasma‐deep reactive ion etching (ICP‐DRIE) system

ICP-RIE STS

Inductively Coupled Plasma, High Rate Magnetic source

ICP-RIE STS Chlore

Chlorine ICP-RIE multiplex STS equipement

CCP-RIE NEXTRAL 56

CCP-RIE Chlorine or CH4-O2 etching

CCP-RIE NEXTRAL 73

Oxygen and fluorine CCP-RIE equipment

CCP-RIE ADVANCE VACCUM

Ce bâti est dédié à la gravures de Silicium, silice, nitrure de silicium et de métaux

CCP-RIE STS

CCP-RIE etching of silica, silicon nitride, silicon

CCP-RIE NEXTRAL 63

Oxygen and fluorine CCP-RIE equipment

CCP-RIE PLASSYS Enseignement

Equipement à donner

IBE ROTH&RAU 1

Ion Beam Etching (IBE) All materials End point detection by mass spectrometry

IBE ROTH&RAU 2

Ion Beam Etching (IBE)

NANOPLAS

Resist stripping Descum Isotropic fluorine etching Surface oxidation Hydrophilic-phobic traitment

DIENER Nano

Atmospheric plasma 13,56 MHz/ 300 Watt with Oxygen or CF4 gas channels

DIENER Pico

Atmospheric plasma 40KHz/200Watt with Oxygen or Argon gas channels

XeF2 Xactix

Vapor phase isotropic silicon etch for structure release