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A short description of the ressource

 

BONDER SB6 SüSS

Short Description

Bonder EVG

Thermo-compression bonding / Eutectic bonding / Anodic bonding / Transfert - wafers 4 pouces - 1/4 wafers 3 pouces - 1/2 wafers 2 pouces - 1/4 wafers 2 pouces

Bonding Oven

Custom bonding Oven

Scie DISCO DAD 641

The saw is a hight precision cutting machine for cutting the various materials used by the C2N laboratory.

µsoudeuse WB200

Micro soudeuse manuelle / semi-automatique / automatique soudure fil Or ou Aluminium - diam 25µm Or : wedge/ wedge ; ball/wedge ; bump Aluminium : wedge/wedge

µsoudeuse WB100

Micro-soudeuse manuelle et semi-automatique Fil Or ou Aluminium - diam 25µm Soudure Or : wedge/wedge ; ball/wedge ; bump Soudure Aluminium : wedge/wedge

µsoudeuse KS

Microsoudure fil or - diam 25µm Wedge/wedge

PP6 MARCOUSSIS

Short Description

PP6 haute température

Short Description

scriber SUSS

Short Description

SCRIBER HR100

Short Description

Scriber KarlSüSS

Short Description

PRESI P400

Automatic mechanical-chemical polishing

MECAPOL 320 D

Automatic mechanical-chemical polishing

Struers lab-pol 5

Manual mechanical polishing

ESCIL300

Manual mechanical-chemical polishing

COLLAGE ANODIQUE

Short Description