
BONDER SB6 SüSS
Short Description
BONDER SB6 SüSS
Short Description
Bonder EVG
Thermo-compression bonding / Eutectic bonding / Anodic bonding / Transfert - wafers 4 pouces - 1/4 wafers 3 pouces - 1/2 wafers 2 pouces - 1/4 wafers 2 pouces
Bonding Oven
Custom bonding Oven
Scie DISCO DAD 641
The saw is a hight precision cutting machine for cutting the various materials used by the C2N laboratory.
µsoudeuse WB200
Micro soudeuse manuelle / semi-automatique / automatique soudure fil Or ou Aluminium - diam 25µm Or : wedge/ wedge ; ball/wedge ; bump Aluminium : wedge/wedge
µsoudeuse WB100
Micro-soudeuse manuelle et semi-automatique Fil Or ou Aluminium - diam 25µm Soudure Or : wedge/wedge ; ball/wedge ; bump Soudure Aluminium : wedge/wedge
µsoudeuse KS
Microsoudure fil or - diam 25µm Wedge/wedge
PP6 MARCOUSSIS
Short Description
PP6 haute température
Short Description
scriber SUSS
Short Description
SCRIBER HR100
Short Description
Scriber KarlSüSS
Short Description
PRESI P400
Automatic mechanical-chemical polishing
MECAPOL 320 D
Automatic mechanical-chemical polishing
Struers lab-pol 5
Manual mechanical polishing
ESCIL300
Manual mechanical-chemical polishing
COLLAGE ANODIQUE
Short Description