Back-End

 

A short description of the ressource

 

Bondeur SB6 SüSS

Substrate Bonder / Anodic and fusion bondings

Bonder EVG501

Thermo-compression bonding / Eutectic bonding / Anodic bonding / Transfert

Bonding Oven

Custom bonding Oven

Dicing Saw DISCO DAD 641

Semi-automatic dicing saws, 8''

Wedge bonding JFP WB200

Semi-Automatic Wire Bonder Ball , Wedge & Bump

Wedge bonding JFP WB100

Semi-Automatic Wire Bonder Ball , Wedge & Bump

Wedge bonding Kulicke & Soffa 4523/6

Wedge bonding - gold wire

Pick And Place JFP PP6-1

High precision die bonder and pick and place

Pick and Place PP6 hight temperature

High precision die bonder and pick and place

Scriber Karl-SUSS RH-100

Manual diamond scriber

Scriber Karl-SüSS

Semi-automatic diamond scriber

Presi P400

Automatic mechanical-chemical polishing

Presi Mecapol P320

Automatic mechanical-chemical polishing

Struers lab-pol 5

Manual mechanical polishing

Escil 300

Manual mechanical-chemical polishing