Contacts : BOUVILLE David / BARDOU Nathalie / HAROURI Abdelmounaim
Location : E331
Submicron resolution @375nm: minimum size down to 0.8 μm Speed: Exposure of a 150 mm wafer in less than 16 minutes. Advanced alignment: The system achieves an alignment accuracy of 500 nm and digitally compensates for offset, rotation and scaling Focus: A dynamic autofocus system ensures sharp and uniform features. Absolute stability: An integrated environmental chamber with temperature-controlled (±0.1°C) laminar airflow minimises the effects of thermal expansion, ensuring stable and reproducible results.
