Wafer bonder Süss SB6

Wafer bonding / Anodic bonding / fusion bonding   /   SussMicrotec

Contacts :   DUPUIS   Christophe     /   HAROURI   Abdelmounaim

Location : Zone litho

  • Space
    BONDER SB6 SüSS
  • Space
    Bonder Süss SB6

Caractéristiques

  • Pressure   :   up to 20kN
  • Temperature range   :   up to 450°C
  • Sample Size   :   up to 4'' wafers
Expertises

BCB (Benzocyclobutene) adhesive bonding

Wafer-to-wafer and die-to-wafer bonding / Controlled bonding layer thickness and uniformity / Well suited for photonic and heterogeneous integration

Contacts : A.Harouri et C.Dupuis

Au/Au thermo-compression bonding

High mechanical strength and electrical conductivity / Suitable for optoelectronic, RF, and photonic devices / Precise control of temperature, pressure, and bonding environment

Contacts : A.Harouri et C.Dupuis

Applications

Application

Heterogeneous photonic integration / Optoelectronic devices / Prototype fabrication and process optimization

Contacts : A.Harouri et C.Dupuis