Centre for Nanoscience
and Nanotechnology

  • CNRS
  • UPSaclay
  • UParis

PIMENT Platform

Sputtering Plassys MP800S

Sputtering deposition technique. Dielectric thin films.   /   Plassys

Contacts :   LAFOSSE   Xavier     /   MAILLARD   François

The main materials sputtered in this machine are Silicon dioxide, silicon nitride, TCOs (ITO and ZnO:Al), Silicon carbide and amorphous carbon.

  • Space
    Sputtering Plassys MP800S
  • Space
    Sputtering Plassys MP 800S
  • Space
    Sputtering Plassys MP 800S - Plasma Ar/N2

Caractéristiques

  • Power   :   up to 2kW (6" targets)
  • Materials   :   SiO2, Si3N4, ZnO:Al, ITO, SiC, Graphite
  • Gas Line   :   Ar, N2, O2
  • Others   :   Height from 60mm to 200mm
  • Max sample size   :   6 inches
  • Temperature   :   up to 500°C
Applications

Isolation

Silicon nitride and Silcon oxide are deposited for basic isolation coatings.

Contacts : xavier.lafosse@c2n.upsaclay.fr

TCO coatings

The deposition of ITO or ZnO:Al is possible on this equipment. These materials are, among others, often used in photovoltaics related processes.

Contacts : xavier.lafosse@c2n.upsaclay.fr; francois.maillard@c2n.upsaclay.fr