Bonding Oven

Custom bonding Oven   /   SEMCO / INSTRON

Contacts :   VILLEBASSE   Cedric  

High-vacuum Bonding Oven with Very good Flatness and Applied Pressure @ 2 inch wafers Custom design equipment combining a SEMCO Oven on a INSTRON Press

  • Space
    Bonding Oven system
  • Space
    Bonding Oven
  • Space
    Bonding Oven and Pc Control

Caractéristiques

  • Substrates   :   Very good flatness on a 2 inch su
  • Others   :   Applied Force up to 2000N
  • Substrate temperature   :   Conduction heating T max=650°C with controlled up and down heating-cooling ramps
  • Vacuum   :   High vacuum under turbo molecular pumping
Expertises

Hybrid Integrated Photonics on Silicon

Transmission Electron Microscope Image of the bonded interface @ Gilles Patriarche @ c2n

  • Space
  • Space

Contacts : Anne Talneau

Applications

Bonding application

Bonding of crystalline or amorphous materials associated without any intermediate layer or with a thin dielectric / polymer layer. Annealing under vacuum with controlled pressure

Contacts : Anne Talneau