Centre for Nanoscience
and Nanotechnology

  • CNRS
  • UPSaclay
  • UParis

PIMENT Platform

Dicing Saw DISCO DAD 641

Semi-automatic dicing saws, 8''   /   DISCO

Contacts :   BOUVILLE   David     /   VILLEBASSE   Cedric   /   ISAC   Nathalie

The discing saw can cut 8" warfer to about chips 5mm and up to 3mm thick.

  • Space
    Scie DISCO DAD 641
  • Space
    Scie DAD 641

Caractéristiques

  • Materials   :   Si, Glass, Saphir, Ge, SiC ...
  • Substrates   :   pieces until 8"
  • Thickness   :   Until 3 mm
  • Others   :   Automatic alignment
  • Others   :   Broken Blade Detector
Expertises

Cut of Sapphire

Cutting Si, Glass, Sapphire, Ge, ...

  • Space

Contacts : david.bouville@c2n.upsaclay.fr

Cross section

Cutting bonding wafer

  • Space

Contacts : Daniel.micha@c2n.upsaclay.fr / David.bouville@c2n.upsaclay.fr

Applications

Cutting for chip laser in photonique

Chip of laser

Contacts : Mario

Chip of resonator

Resonator for photonique

Contacts : Xavier