Pick and place JFP PP6-1
High precision die bonder and pick and place / JFP MICROTECHNIC
Contacts :
Location : N.C.
High precision die bonder and pick and place
Caractéristiques
- Max sample size : up to 200×300 mm
- Stage : X - 260 mm, Y - 120 mm
- Positioning accuracy : <3µm
- Others : Full automated process
- Others : Face up & Face down
